I Machine structure features and performance

1.         This machine is designed with three working stations and two spindles, and the grinding is realized by turning worktable, rough grinding and fine grinding;

2.         Turing working table is designed as “Vapour rotation – Vacuum fixation”;

3.         Grinding spindle system is constituted of grinding spindle, spindle seat, vertical pillar, and in-process measuring device for grinding force; Low friction cylinders on both sides of the spindle seat are used to balance the gravity of the spindle part and to increase the motion flexibility of the feed system;

4.         Grinding spindle and part spindle are all designed with electric spindle with air static bearing, which with the advantages like high rotating precision, and low vibration, is conductive to the productivity improving and wafer surface roughness reduction;

5.         Micro feed system is driven by servo motor through ball screw for grinding spindle for grinding and feed motion; Feed speed of this system, with 0.1 μm motion resolution, can achieve minimum 0.1 μm/s, and have a good response speed;

6.         This machine is designed with auto position adjustment and thickness in-process measuring system;

7.         There’s a micro adjustment device for the angle between grinding spindle and part spindle, so that to ensure the wafer’s surface shape;

8.         This machine is designed with high precision and high reliability clamping positioning and conveying technology for the wafer, and with reliable automatic centering mechanism; A four-degree-freedom R-θ joint manipulatoris used forwafer transport, so that realized the auto change between each working station.

9.   This machine is designed with auto cleaning, drying and the auto cleaning for chuck, so that realize the wafer’s dry in and dry out in the grinding process;